| Electrovert
Econopak II SMT Specifications |
| General Description |
| Epk-II
SMT: |
|
The Electrovert Wavesolder Machine
is a high quality wave soldering system featuring the additional
requirements for automatic soldering of surface mounted devices
(SMDs). It also features small size, ease of access, and ergonomic
design. Full access to modules allow for easy cleaning and maintenance,
and its human engineered form make it an attractive addition to
today's clean and modern plants. |
| Standard Equipment |
| Computer Control
System: |
|
The computer functions as the control center
of all decisions involving the operations of the wavesoldering
system. It receives inputs from thermal probes and other sensing
devices used throughout the system. The computer compares this
data to the process parameters (set points) and precisely controls
the various speeds, temperatures, solder wave requirements, etc.
The computer is operated from the control console, consisting
of two 4 x 4 keypads separated by a LED display window. Set points
and control commands are entered via the keypads. System status,
process parameters, alarm messages, etc. appear in the display
window. |
| Emergency Controls: |
|
Two (2) red emergency stop push buttons are mounted, one at
each front corner of the system cabinet. This control is used
to stop all system operations, including conveyor motion, but
does not shut off the solder heaters. If activated while a card
is being processed, the card would remain where it was stopped
within the conveyor path. This could expose the card to potentially
damaging environmental conditions.
|
| Construction
and Enclosure: |
|
The frame is a sturdy welded steel structure
supported off the floor by eight (8) leveling feet/pads. It includes
a bolt-on roll out stand which enables the solder module to be
rolled out to its full service position. Also featured is a one-piece
hinged hood that enables full access to all modules. Interior
hood lights and front viewing windows which enable full viewing
of production processes when the hood is closed. |
| Pallet Conveyor System: |
|
The variable speed pallet conveyor transports the carrier (which
holds the pcb) through the three process stages of fluxing, preheating
and wave soldering. The conveyor consists of two roller chains
(one front and one rear) each mounted in respective front and
rear rails with a 6° incline to optimize soldering results. |
| Foam Fluxer: |
|
The foam fluxer is designed to produce the
finest possible foaming action consistent with the properties
of the flux being used. A layer of flux is deposited on the underside
of the board resulting in minimum residue after the soldering
operation. The fluxer is constructed of Titanium which will handle
most of the fluxes encountered in the electronics industry. Low
pressure compressed air is diffused through double aerator tubes
to form a foam head of uniform bubble size. An adjustable air
knife removes excess flux to minimize drippings and waste. Separate
air gauges and regulators are provided for each aerator and air
knife. |
| Preheater: |
|
The infrared preheater thermally conditions the board prior
to soldering. The IR preheater consists of a stainless steel box
enclosure fitted with three banks of heating tubes which may be
switched independently. The heating elements which run parallel
to conveyor travel, are fitted with highly resistant insulators.
The tubes are protected by a heat treated, high impact, ceramic
glass panel, which is secured by four latch clamps. The enclosure
cavity is insulated on the sides and the bottom. The terminal
box is located on the underside of the. preheater. Each set of
two elements are plugged into separate terminal blocks, for ease
of replacement. The preheater assembly is supported from the conveyor
rails via support brackets. For servicing, the preheater can be
disconnected and lifted out from the supports. Preheat temperature
is controlled electronically. Each preheater is divided into 3
zones, separately selected by the operator. The LED display shows
the actual and set point temperatures. |
| Heat Tunnel: |
|
Mounted over the IR preheater(s), used to
reduce heat loss. This unit is easily removed for ready access
to the rail, preheater module, or conveyor. |
| Time Clock: |
|
A battery backed, real time clock mounted on the microprocessor
board to allow preshift start up of the solder heaters for clock
controlled solder melting. |
| Automatic
Start Operation: |
|
A sensor located at the load end entrance
of the conveyor senses the PCB as it enters the system for processing.
When enabled, it allows the solder wave(s) to run only when a
board is actually within the machine. |
| Solder Module: |
|
The solder module features stainless steel construction, a
medium capacity solderpot with readily removable heaters, regardless
of the solder condition. The Lambda wave is standard and has a
maximum 1/2" (12.7 mm) stable height, adjustable by means
of an electronic speed controller. The solder temperature controller
has high and low limit alarms incorporated in its design. This
protects the pump from operating in a solid or "plastic"
solder state. |
| Rollout
Jacking Stand: |
|
The jacking stand is attached to the rear
of the machine adjacent to the solder module. This feature is
used to roll the solder pot out onto for servicing and maintenance.
The height is adjustable via screw pads on the stand legs. |
| Optional Equipment |
| FDC-400
Flux Density Controller: |
|
The FDC unit assures the consistency of
flux density. It consists of a density sensor probe and level/temperature
probe suspended in the fluxer tank. The FDC-400 regulates the
flux and thinner pumps controlling the density of the flux in
use. |
| Wave Fluxer: |
|
Replaces the standard foam fluxer. Applies flux by pumping
a liquid wave of flux to the underside of the PCB as it passes
over the fluxer. This type of application is excellent for Surface
Mounted Technology (SMT) and other difficult fluxing processes. |
| Finger Conveyor: |
|
The finger conveyor is powered by a variable
speed DC drive motor and is fixed at a 6° incline. The fingers
are attached to a double chain driven by a hex drive gear that
floats on a hex drive shaft. The conveyor width is adjustable
from the load end of the machine by means of a handwheel. Load
guides and 12" unload extensions are standard as well as
the finger cleaning system. The finger cleaner provided with this
option has a low level protection/alarm circuit. |
| Motorized Conveyor Width: |
|
Computer controlled automatic width adjustment with digital
readout and manual backup. The width is changed via the operator's
set point input. |
| Finger Masks: |
|
This feature is designed to mask/shield
the gold connectors on the edge of the PCB assembly from exposure
to flux and/or solder as the conveyor passes over these modules.
The mask functions by placing a shield/mask between the printed
circuit board (PCB) and the flux/solder wave. |
| Cooling Fan Module: |
|
This option is used to cool the PCB as it leaves the system
cabinet. It consists of four (4) small fans mounted in a unique
steel housing, designed for maximum cooling effect on the PCB. |
| Omega Wave: |
|
The Omega Wave is designed to eliminate
soldering defects, especially solder skips, in SMDs wavesoldering.
It also improves the soldering of conventional boards by improving
through-hole filling. |
| Additional Preheaters: |
|
Two (2) overhead and/or one (1) additional bottom preheater
for a total of 4 maximum. The overhead preheaters replace the
heater tunnels. |
| Pyrometer: |
|
This read only JR sensor is used to detect
the PCB surface temperature prior to soldering. It has programmable
temperature deviation alarms with programmable alarm actions. |
| Turbulent/Chip Wave: |
|
The Turbulent Wave is operated independent of the Lambda or
the Omega waves. This wave is used for surface mounted device
(SMD) board soldering. This wave nozzle is mounted forward of
the existing Lambda/Omega nozzle and has its own separate pump
motor and control system. This wave produces a pumped, multi-directional
wave, allowing solder to reach the more difficult areas of the
SMT type boards, ensuring full and proper wetting of all solder
contact points. |
| Additional
Emergency push buttons: |
|
To be mounted on the rear corners of the
system cabinet, providing emergency stop controls at each corner
of the cabinet. |
| C02 Fire extinguisher system: |
|
Mounted internally to the system cabinet with externally mounted
controls, used to automatically activate in case of a system fire. |
| Optional Software: |
|
Systems Interface Protocol (SIP), Electrosoft/Electrosave
-process control software. Used for remote monitoring and process
control and management. |
| System Identification Number
|
| Epk-II SMT: |
|
Each system/machine is identified by a serial
number. This number is inscribed on the name plate of the machine.
Locate and note this serial number, it's required for parts procurement
and system identification. The serial number has the following
format: # 0890503002/LV-220 |
| Program Identification Number |
| Epk-II SMT: |
|
The program used to operate the system is
stored in the computer memory card. This program controls the
overall operation of the machine.
When the system is initially powered up (turned on), the serial
number will be displayed in the window located between the two
(2) keypads on the control console. The format will be one of
two (2) possible displays. This information is required for system
upgrading and possible troubleshooting of system operations. The
following are examples of the program number:
6-1904-125-XX-1 or 6-1904-103-XX-1 XX = the revision number of this
machine's operating program.
125 = normal machine configuration.
103 = a machine configured with one or more of the following options:
Pyrometer, Motorized width adjustment, addition of the 4th preheater,
with or without Electrosoft and/or SIP (software options). |
| Technical Data |
| Models Available: |
|
12" (300 mm) process width - (13"
Max. Finger Type)
15" (400 mm) process width - (16" Max. Finger Type) |
| Power: |
|
220 VAC, 3 Phase, 4 wire, 50/60 Hz or
380 VAC, 3 Phase, 5 wire, 50/60 Hz or
440 VAC, 3 phase, 4 wire, 50/60 Hz |
| Power Consumption: |
|
13.9 KVA on 12" (300 mm) models
(Add 6.3 KVA per additional preheater.)
15.1 KVA on 15" (400 mm) models
(Add 7.5 KVA per additional preheater.) |
| Exhaust Data: |
|
425 cfm (201 Us) total at 0.3" (8 mm) of water; divided
evenly between each of the two 6" (152 mm) stacks.
* Exhaust dampers should be added at each stack to assist in balancing
the ventilation flow. |
| Compressed
Air Data: |
|
| Fluxer Aerator: |
|
approximate consumption of 2 cfm
at 5 psi (0.94 1./s at 35 kPa) |
| Flux Air knife: |
|
approximate consumption of 5 cfm at 30 psi
(2.36 L/s at 138 kPa) |
| Pressure regulator (inlet connection)
limits output to 50 psi (340 kPa) maximum. Air supply to aerator
must be clean and dry to prevent clogging and contamination
- use oil filter and water trap if necessary. |
|
| Conveyor Data: |
|
| Process Speed: |
|
0 to 16 fpm (0 to 5 MPM) ±1%
of max. speed |
| Process Width: |
|
12" or 15" (300 mm or 400 mm) |
|
Fluxer Data:
|
|
| Foam Height: |
|
1/2" (12.7 mm) dependent on
flux foaming properties |
| Flux Capacity: |
|
12" (300 mm) = 3.35 U.S. gal. (12.68 L)
15" (400 mm) = 3.35 U.S. gal. (12.68 L) |
|
| FDC-400 (option): |
|
| Density range: |
|
0.750 - 1.000 ±0.003 |
| Temperature range: |
|
32- 122°F (0-50°C) ±4.5°F
(±2.5C) |
| Set point range: |
|
0.750 - 0.999
(selectable in 0.001 increments) |
|
| Finger Cleaner Data: |
|
| Solvent capacity: |
|
1.87 U.S. gal. (7.1 L) |
|
| Preheater Data: |
|
| Temperature sensor: |
|
Type K, ungrounded thermocouple |
| Temperature range: |
|
32 - 1112°F (0- 600°C) |
| Max Temp: |
|
1112°F (600°C) |
| Power Consumption: |
|
6.3 KVA on 12" (300 mm) models
7.5 KVA on 15" (400 mm) models |
| Warm up time: |
|
15 minutes (approx.) |
|
| Solder Module Data: |
|
| Solder Capacity: |
|
800 lb (364 kg) |
| Power Consumption: |
|
5.6 KVA (all models) |
| Typical Operating Temps: |
|
500°F (260°C) |
| Mm. Operating Temp: |
|
428°F (220°C) |
| Max. Operating Temp: |
|
600°F (3 16°C) |
| Warm up time: |
|
3-4 hours from 75°F to 500°F
(24°C to 260°C) |
|
| Carrier Data: |
|
Standard carriers accept boards up to 12" (300 mm) and
15" (400 mm) wide for respective models. Special carriers
are available upon request. |
| Machine Weight: |
|
1400 lb (635 kg) gross, without solder. |
| Overall Dimensions: |

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